PCB MATERIALS:

Solutions For High-Technology Applications

Viasystems’ printed circuit boards (PCBs) feature all the major PCB materials solutions for standard, high technology, and RF PCB applications. Please see the following for specific materials by category and capability:

Viasystems Materials offerings for facilities in Guangzhou & Zhongshan Material categories / capability:

Dicy & Phenolic, filled and unfilled

Hi-Speed / Low Loss

PPO/FR4
Modified FR4
BT/FR4
Ceramic filled Hydro-carbons
Teflons and ceramic filled teflons

Halogen Free

Mid to Hi-Tg Availability
Latest state of the art RoHS compliant
Fillers
N-ring
P connect to backbone

RoHS & Viasystems:

100% RoHS compliant

Laminated & Prepreg
Soldermasks
Legend inks
Surface finishes
Via fill

RoHS assembly compatible with all material categories (ref above)

Some Dicys for (2L) or DSR
Filled and unfilled Mid-Tg Phenolics for MLB
Filled and unfilled Hi-Tg Phenolics for MLB
Some Halogen Free - both Mid & Hi-Tg for DSR & MLB

CAF & Viasystems:

Offer solutions for both DSR and MLB
Detailed Dialogue between Customer & Viasystems Required
Materials and Design Relevant

PCB MATERIALS:

Solutions For High-Technology Applications

Viasystems Materials offerings for facilities in Guangzhou & Zhongshan Material categories / capability:

RoHS & Viasystems:

CAF & Viasystems:

Full Underwriter Laboratories available for most materials.